Semiconductor devices and methods of manufacturing semiconductor devices

ABSTRACT

In one example, a semiconductor device, comprises a first redistribution layer (RDL) substrate comprising a first dielectric structure and a first conductive structure through the first dielectric structure and comprising one or more first conductive redistribution layers, an electronic component over the first RDL substrate, wherein the electronic component is coupled with the first conductive structure, a body over a top side of the first RDL substrate, wherein the electronic component is in the body, a second RDL substrate comprising a second dielectric structure over the body, and a second conductive structure through the second dielectric structure and comprising one or more second conductive redistribution layers, and an internal interconnect coupled between the first conductive structure and the second conductive structure. Other examples and related methods are also disclosed herein.

TECHNICAL FIELD

The present disclosure relates, in general, to electronic devices, andmore particularly, to semiconductor devices and methods formanufacturing semiconductor devices.

BACKGROUND

Prior semiconductor packages and methods for forming semiconductorpackages are inadequate, for example resulting in excess cost, decreasedreliability, relatively low performance, or package sizes that are toolarge. Further limitations and disadvantages of conventional andtraditional approaches will become apparent to one of skill in the art,through comparison of such approaches with the present disclosure andreference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-sectional view of an example semiconductor device.

FIGS. 2A to 2L show cross-sectional views of an example method formanufacturing an example semiconductor device.

FIGS. 3A to 3I show cross-sectional views of an example method formanufacturing an example semiconductor device.

FIG. 4 shows a cross-sectional view of an example semiconductor device.

FIG. 5 shows a cross-sectional view of an example semiconductor device.

FIGS. 6A to 6Q show cross-sectional views of an example method formanufacturing an example semiconductor device.

FIG. 7 shows cross-sectional views of an example method formanufacturing an example semiconductor device.

FIG. 8 shows cross-sectional view of an example method for manufacturingan example semiconductor device.

FIGS. 9A to 9D show cross-sectional views of an example structure formanufacturing an example semiconductor device.

FIGS. 10A to 10D show cross-sectional views of an example structure formanufacturing an example semiconductor device.

The following discussion provides various examples of semiconductordevices and methods of manufacturing semiconductor devices. Suchexamples are non-limiting, and the scope of the appended claims shouldnot be limited to the particular examples disclosed. In the followingdiscussion, the terms “example” and “e.g.” are non-limiting.

The figures illustrate the general manner of construction, anddescriptions and details of well-known features and techniques may beomitted to avoid unnecessarily obscuring the present disclosure. Inaddition, elements in the drawing figures are not necessarily drawn toscale. For example, the dimensions of some of the elements in thefigures may be exaggerated relative to other elements to help increaseunderstanding of the examples discussed in the present disclosure. Thesame reference numerals in different figures denote the same elements.

The term “or” means any one or more of the items in the list joined by“or”. As an example, “x or y” means any element of the three-element set{(x), (y), (x, y)}. As another example, “x, y, or z” means any elementof the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y,z)}.

The terms “comprises,” “comprising,” “includes,” or “including,” are“open ended” terms and specify the presence of stated features, but donot preclude the presence or addition of one or more other features. Theterms “first,” “second,” etc. may be used herein to describe variouselements, and these elements should not be limited by these terms. Theseterms are only used to distinguish one element from another. Thus, forexample, a first element discussed in this disclosure could be termed asecond element without departing from the teachings of the presentdisclosure.

Unless specified otherwise, the term “coupled” may be used to describetwo elements directly contacting each other or describe two elementsindirectly connected by one or more other elements. For example, ifelement A is coupled to or with element B, then element A can bedirectly contacting element B or indirectly connected to element B by anintervening element C. Similarly, the terms “over” or “on” may be usedto describe two elements directly contacting each other or describe twoelements indirectly connected by one or more other elements.

DESCRIPTION

In one example, a semiconductor device, comprises a first redistributionlayer (RDL) substrate comprising a first dielectric structure and afirst conductive structure through the first dielectric structure andcomprising one or more first conductive redistribution layers, anelectronic component over the first RDL substrate, wherein theelectronic component is coupled with the first conductive structure, abody over a top side of the first RDL substrate, wherein the electroniccomponent is in the body, a second RDL substrate comprising a seconddielectric structure over the body, and a second conductive structurethrough the second dielectric structure and comprising one or moresecond conductive redistribution layers, and an internal interconnectcoupled between the first conductive structure and the second conductivestructure.

In another example, method to manufacture a semiconductor device,comprises providing a bottom substrate on a bottom carrier, wherein thebottom substrate comprises a first dielectric structure, a firstconductive structure, and a top interconnect at a first side of thebottom substrate, providing an electronic component over the bottomsubstrate, wherein the electronic component is coupled with the firstconductive structure, providing a top substrate on a top carrier,wherein the top substrate comprises a second dielectric structure, asecond conductive structure, and a bottom interconnect on a first sideof the top substrate, providing an internal interconnect coupled withone of the top interconnect of the bottom substrate or the bottominterconnect of the top substrate, providing the top substrate over thebottom substrate, wherein the top substrate is inverted with respect tothe bottom substrate, coupling the internal interconnect to another oneof the top interconnect of the bottom substrate or the bottominterconnect of the top substrate, providing a body between the bottomsubstrate and the top substrate, wherein the electronic component is inthe body, removing the top carrier and the bottom carrier, andsingulating through the top substrate, the bottom substrate, and thebody.

In an additional example, a method to manufacture a semiconductordevice, comprises providing a bottom substrate on a bottom carrier,wherein the bottom substrate comprises a first dielectric structure, afirst conductive structure, and a top interconnect at a first side ofthe bottom substrate, providing an electronic component over the bottomsubstrate, wherein the electronic component is coupled with the firstconductive structure, providing a top substrate on a top carrier,wherein the top substrate comprises a second dielectric structure, asecond conductive structure, and a bottom interconnect on a first sideof the top substrate, providing an internal interconnect coupled withone of the top interconnect of the bottom substrate or the bottominterconnect of the top substrate, singulating through the top substrateand the top carrier to define a first top substrate unit, providing thefirst top substrate unit over the electronic component and over thebottom substrate, coupling the internal interconnect with another one ofthe top interconnect of the bottom substrate or the bottom interconnectof the top substrate, providing a body between the bottom substrate andthe first top substrate unit, wherein the electronic component is in thebody, and wherein the body covers a periphery of the first top substrateunit, removing the top carrier and the bottom carrier, and singulatingthe first top substrate unit, the bottom substrate, and the body.

Other examples are included in the present disclosure. Such examples maybe found in the figures, in the claims, or in the description of thepresent disclosure.

FIG. 1 shows a cross-sectional view of an example semiconductor device10. In the example shown in FIG. 1 , semiconductor device 10 cancomprise bottom substrate 11, external interconnects 12, electroniccomponent 14, body 15, underfill 16, internal interconnects 18 and topsubstrate 19. In some examples, semiconductor device 10 can furthercomprise electronic component 13 under bottom substrate 11.

Bottom substrate 11 can comprise conductive structure 111 comprisingconductive paths 1111, top interconnects 1112 and bottom interconnects1113, and dielectric structure 112. Electronic component 14 can comprisedevice interconnects 141. Top substrate 19 can comprise conductivestructure 191 comprising conductive paths 1911, top interconnects 1912and bottom interconnects 1913, and dielectric structure 192. In someexamples, multiple electronic components 14 can be coupled betweenbottom substrate 11 and top substrate 19. In some examples, multipleelectronic components 13 can be coupled at the bottom of bottomsubstrate 11. In some examples, electronic component 13 can comprise orrepresent one or more active components or passive components. In someexamples, electronic component 14 can comprise or represent one or morepassive components or active components or can be similar to electroniccomponent 13.

Bottom substrate 11, external interconnects 12, underfill 16, internalinterconnects 18 and top substrate 19 can be referred to as asemiconductor package which can protect electronic component 14 fromexternal elements or environmental exposure. In some examples,semiconductor package can provide electrical coupling between externaldevice and external interconnects. In some examples, dielectricstructure 112 or dielectric structure 192 can be coreless.

FIGS. 2A to 2L show cross-sectional views of an example method formanufacturing semiconductor device 10. FIG. 2A shows a cross-sectionalview of semiconductor device 10 at an early stage of manufacture.

In the example shown in FIG. 2A, bottom substrate 11 can be provided onbottom carrier 11A. In some examples, bottom carrier 11A can comprise orcan be referred to as a circular wafer or a rectangular panel. In someexamples, bottom carrier 11A can comprise a silicon, glass, ceramic, ormetal material. In some examples, bottom substrate 11 can be formed onbottom carrier 11A, or can be pre-formed and then coupled with bottomcarrier 11A.

Seed layer 11B can be located on bottom carrier 11A. In some examples,seed layer 11B can be deposited, such as by sputtering or spraying. Insome examples, a titanium tungsten (TiW) sublayer can first bedeposited, and a copper (Cu) sublayer can then be deposited on the TiWsublayer to define seed layer 11B. Seed layer 11B can have a thicknessin the range from approximately 0.1 μm to approximately 1 μm. Seed layer11B can allow an electrical base on which conductive structure 111 canbe formed, such as by plating.

In some examples, a temporary adhesive can be located on bottom carrier11A, and seed layer 11B can be formed on the temporary adhesive. Thetemporary adhesive can be configured to be releasable by heat or lightto allow bottom carrier 11A to be removed from bottom substrate 11 in asubsequent process.

Dielectric structure 112 can comprise one or more dielectric layers andcan be deposited on seed layer 11B. In some examples, dielectricstructure 112 can be provided using a spin coating process or a spraycoating process or can be applied as a pre-formed film. In someexamples, dielectric structure 112 can comprise or can be referred to aspolyimide (PI), benzocyclobutane (BCB), or polybenzoxazole (PBO).Dielectric structure 112 can have a thickness in the range fromapproximately 2 μm to approximately 20 μm.

In some examples, a patterned mask can be positioned on dielectricstructure 112 and light can be irradiated into the patterned mask topattern dielectric structure 112. In some examples, such aphotolithography process can be performed using stepper equipment. Aspatterned portions or non-patterned portions of dielectric structure 112are developed, dielectric structure 112 can comprise openings.Dielectric structure 112 having openings can be used as the mask toexpose a region of seed layer 11B through the openings of dielectricstructure 112. With portions of seed layer 11B exposed through openingsof dielectric structure 112, current can be supplied via seed layer 11Bfor an electroplating in the openings of dielectric structure 112.

Conductive structure 111, for example bottom interconnects 1113, can beformed on seed layer 11B positioned inside the openings of dielectricstructure 112. Bottom interconnects 1113 can comprise or can be referredto as pads, lands, Under Bumped Metallizations (UBMs), or pillars. Insome examples, bottom interconnects 1113 can be provided by platingcopper (Cu) or nickel (Ni), sequentially plating gold (Au) and copper(Cu), or sequentially plating gold (Au) and nickel (Ni), on the exposedportions of seed layer 11B and into the openings of dielectric structure112. Bottom interconnects 1113 can have a line/space/thickness in therange from approximately 0.5/0.5/0.5 micrometers (μm) to approximately10/10/10 μm. In some examples, bottom interconnects 1113 can be providedusing electroplating equipment containing a copper (Cu) solution, anickel (Ni) solution, or a gold (Au) solution. In a subsequent process,external interconnects 12 can be connected to bottom interconnects 1113.

Further seed layers 11B, conductive paths 1111 and top interconnects1112 of conductive structure 111, and dielectric layers of dielectricstructure 112, can be provided in a similar manner to that describedabove. Conductive paths 1111 can comprise or can be referred to aspatterns, traces, or vias. In some examples, a conductive path 1111 cancomprise a metallic layer that defines a sibling trace and via, with thevia extending from the trace as part of the same metallic layer. In thepresent example, the vias of conductive paths 1111 are shown as downwardvias in that they are positioned below their respective sibling tracesor extend downward from their respective sibling traces towards thebottom of bottom substrate 11 or the bottom of semiconductor device 10.

Conductive paths 1111 can be generally positioned inside dielectricstructure 112, between respective dielectric layers of dielectricstructure 112. Top interconnects 1112 can comprise or can be referred toas pads, lands, Under Bumped Metallizations (UBMs), vias, downward vias,or pillars. In some examples, top interconnects 1112 can protrude fromdielectric structure 112. Conductive paths 1111 can electrically connectbottom interconnects 1113 with top interconnects 1112, and topinterconnects 1112 can electrically connect electronic component 14 withconductive paths 1111. In some examples, a bonding material, for examplesolder or gold, can be further located on top interconnects 1112. Insome examples, a stencil having openings corresponding to topinterconnects 1112 can be positioned, solder paste can be positioned onthe stencil, and a predetermined amount of solder paste can then bepositioned on top interconnects 1112 by a subsequent squeezing processusing a blade. In some examples, solder can be plated on topinterconnects 1112 followed by reflowing. In some examples, more orfewer layers of conductive structure 111 or of dielectric structure 112can be provided.

Bottom substrate 11 can comprise multiple units located on a singlebottom carrier 11A. In some examples, multiple bottom substrate 11 unitscan be located on one single bottom carrier 11A in the form of strips orarrays to increase production efficiency of semiconductor device 10.

In the present example, bottom substrate 11 is presented as aredistribution layer (“RDL”) substrate. RDL substrates can comprise oneor more conductive redistribution layers and one or more dielectriclayers that (a) can be formed layer by layer over an electronic deviceto which the RDL substrate is to be electrically coupled, or (b) can beformed layer by layer over a carrier that can be entirely removed or atleast partially removed after the electronic device and the RDLsubstrate are coupled together. RDL substrates can be manufactured layerby layer as a wafer-level substrate on a round wafer in a wafer-levelprocess, or as a panel-level substrate on a rectangular or square panelcarrier in a panel-level process. RDL substrates can be formed in anadditive buildup process that can include one or more dielectric layersalternatingly stacked with one or more conductive layers that definerespective conductive redistribution patterns or traces configured tocollectively (a) fan-out electrical traces outside the footprint of theelectronic device, or (b) fan-in electrical traces within the footprintof the electronic device. The conductive patterns can be formed using aplating process such as, for example, an electroplating process or anelectroless plating process. The conductive patterns can comprise anelectrically conductive material, for example copper or other plateablemetal. The locations of the conductive patterns can be made using aphoto-patterning process such as a photolithography process and aphotoresist material to form a photolithographic mask. The dielectriclayers of the RDL substrate can be patterned with a photo-patterningprocess which can include a photolithographic mask through which lightis exposed to photo-pattern desired features such as vias in thedielectric layers. Thus, the dielectric layers can be made fromphoto-definable organic dielectric materials, for example polyimide(PI), benzocyclobutene (BCB), or polybenzoxazole (PBO). Such dielectricmaterials can be spun-on or otherwise coated in liquid form rather thanattached as a pre-formed film. To permit proper formation of desiredphoto-defined features, such photo-definable dielectric materials canomit structural reinforcers or can be filler-free, without strands,weaves, or other particles, that could interfere with the light from thephoto-patterning process. In some examples, such filler-freecharacteristics of filler-free dielectric materials can permit areduction of the thickness of the resulting dielectric layer. Althoughthe photo-definable dielectric materials described above can be organicmaterials, in some examples the dielectric materials of the RDLsubstrates can comprise one or more inorganic dielectric layers. Someexamples of inorganic dielectric layer(s) can comprise silicon nitride(Si3N4), silicon oxide (SiO2), or silicon oxynitride (SiON). Theinorganic dielectric layer(s) can be formed by growing the inorganicdielectric layers using an oxidation or nitridization process insteadusing photo-defined organic dielectric materials. Such inorganicdielectric layers can be filler-fee, without strands, weaves, or otherdissimilar inorganic particles. In some examples, the RDL substrates canomit a permanent core structure or carrier such as, for example, adielectric material comprising bismaleimide triazine (BT) or FR4 andthese types of RDL substrates can be referred to as a corelesssubstrate.

In some examples, bottom substrate 11 can be a pre-formed substrate. Thepre-formed substrate can be manufactured prior to attachment to anelectronic device and can comprise dielectric layers between respectiveconductive layers. The conductive layers can comprise copper and can beformed using an electroplating process. The dielectric layers can berelatively thicker non-photo-definable layers that can be attached as apre-formed film rather than as a liquid and can include a resin withfillers such as strands, weaves, or other inorganic particles forrigidity or structural support. Since the dielectric layers arenon-photo-definable, features such as vias or openings can be formed byusing a drill or laser. In some examples, the dielectric layers cancomprise a prepreg material or Ajinomoto Buildup Film (ABF). Thepre-formed substrate can include a permanent core structure or carriersuch as, for example, a dielectric material comprising bismaleimidetriazine (BT) or FR4, and dielectric and conductive layers can be formedon the permanent core structure. In some examples, the pre-formedsubstrate can be a coreless substrate which omits the permanent corestructure, and the dielectric and conductive layers can be formed on asacrificial carrier that is removed after formation of the dielectricand conductive layers and before attachment to the electronic device.The pre-formed substrate can be referred to as a printed circuit board(PCB) or a laminate substrate. Such pre-formed substrate can be formedthrough a semi-additive or modified-semi-additive process.

In some examples, as shown in FIG. 2A, bottom substrate 11 can comprisea an RDL substrate comprising a dielectric structure 112 and aconductive structure 111 through the dielectric structure 112.Conductive structure 111 can comprise conductive paths 1111 comprisingone or more conductive redistribution layers.

FIG. 2B shows a cross-sectional view of semiconductor device 10 atanother stage of manufacture. In the example shown in FIG. 2B,electronic component 14 can be positioned over bottom substrate 11. Insome examples, electronic component 14 can be coupled with topinterconnects 1112 of bottom substrate 11. In some examples, electroniccomponent 14 can be coupled with the first conductive structure 111. Insome examples, electronic component 14 can comprise or can be referredto as a chip, a die, or a package. The chip or die can comprise anintegrated circuit singulated from a semiconductor wafer. In someexamples, electronic component 14 can comprise a digital signalprocessor (DSP), a network processor, a power management unit, an audioprocessor, a radio-frequency (RF) circuit, a wireless baseband system onchip (SoC) processor, a sensor, or an application specific integratedcircuit (ASIC). In some examples, electronic component 14 can comprise apassive component such as one or more resistors, capacitors, orinductors. Electronic component 14 can have a thickness in the rangefrom approximately 20 μm to approximately 300 μm.

Electronic component 14 can comprise device interconnects 141 that canbe coupled with top interconnects 1112. In some examples, deviceinterconnects 141 can comprise or can be referred to as pads, pillars,or bumps. In some examples, device interconnects 141 can be connected totop interconnects 1112 through bonding materials. In some examples,electronic component 14 can be coupled with top interconnects 1112 usinga mass reflow process, a thermal compression process, or a laser assistbonding process. In addition, device interconnects 141 can have athickness in the range from approximately 1 μm to approximately 50 μm.

In some examples, underfill 16 can be positioned between bottomsubstrate 11 and electronic component 14. In some examples, underfill 16can be injected or absorbed into a gap between electronic component 14and bottom substrate 11 after electronic component 14 is coupled withbottom substrate 11. In some examples, underfill 16 can be coated onbottom substrate 11 in advance before electronic component 14 isconnected to bottom substrate 11. Accordingly, device interconnects 141can pass through underfill 16 to then be coupled with bottom substrate11 at the same time when electronic component 14 presses underfill 16.In some examples, a curing process can be further performed on underfill16. In some cases, when an inorganic filler of body 15 has a smallersize than the gap between electronic component 14 and bottom substrate11, underfill 16 can comprise a portion of body 15 that extends into thegap, or the processes associated with underfill 16, for example filling,injecting, coating, or curing, can be omitted.

FIG. 2C shows a cross-sectional view of semiconductor device 10 atanother stage of manufacture. In the example shown in FIG. 2C, topsubstrate 19 can be formed or positioned over top carrier 19A using seedlayer 19B. In some examples, top carrier 19A can be similar to bottomcarrier 11A. In some examples, top substrate 19 can be similar to bottomsubstrate 11 in terms of materials, structure, or method of manufacture.Top substrate 19 can comprise conductive structure 191 with conductivepaths 1911, top interconnects 1912, or bottom interconnects 1913, whichcan be similar to conductive structure 111 with respective conductivepaths 1111, top interconnects 1112, or bottom interconnects 1113. Topsubstrate 19 can comprise dielectric structure 192 with one or moredielectric layers, similar to dielectric structure 112. In someexamples, the number of layers of top substrate 19 shown in FIG. 2C canbe smaller than, equal to or greater than the number of layers of bottomsubstrate 11 shown in FIG. 2A. Top substrate 19 can comprise multipleunits located on one single top carrier 19A. In some examples, multipletop substrate 19 units can be located on one single top carrier 19A informs of strips or arrays to enhance production efficiency ofsemiconductor device 10.

FIG. 2D shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2D, internalinterconnects 18 can be positioned on top substrate 19. In someexamples, internal interconnects 18 can be connected to bottominterconnects 1913 through a bonding material. Internal interconnects 18can comprise or can be referred to as metallic-core balls, pillars, orsolder balls. In the case of metallic-core balls, interconnects 18 cancomprise a metallic core 18 a surrounded by solder coating 18 b, wheremetallic core 18 a can comprise copper or other metal with highermelting point than solder coating 18 b. Internal interconnects 18 canhave a diameter in the range from approximately 50 μm to approximately300 μm. Internal interconnects 18 can electrically connect bottomsubstrate 11 and top substrate 19 to each other in finalizedsemiconductor device 10. In some examples, internal interconnects 18 canbe located on top interconnects 1112 of bottom substrate 11, rather thantop substrate 19.

In some examples, processes shown in FIGS. 2A and 2B can be performedand processes shown in FIGS. 2C and 2D can then be performed. In someexamples, processes shown in FIGS. 2C and 2D can be performed andprocesses shown in FIGS. 2A and 2B can then be performed. In someexamples, processes shown in FIGS. 2A and 2B and processes shown inFIGS. 2C and 2D can be simultaneously performed.

FIGS. 2E and 2F show a cross-sectional view of semiconductor device 10at a later stage of manufacture. In the example shown in FIGS. 2E and2F, top substrate 19 and bottom substrate 11 can be coupled to eachother. In some examples, internal interconnects 18 previously connectedto bottom interconnects 1913 of top substrate 19 can be coupled with topinterconnects 1112 of bottom substrate 11. In some examples, internalinterconnects 18 previously connected to top interconnects 1112 ofbottom substrate 11 can be coupled with bottom interconnects 1913 of topsubstrate 19. In some examples, internal interconnect 18 can be providedbetween top substrate 19 and bottom substrate 11, and can be coupledwith one of top interconnect 1112 of bottom substrate 11, or bottominterconnect 1913 of top substrate 19, before top substrate 19 andbottom substrate 11 are brought together. After substrates 19 and 11 arebrought together, internal interconnects 18 coupled with top or bottominterconnects of one substrate can be coupled with corresponding bottomor top interconnects of the other substrate. In some examples, topsubstrate 19 and bottom substrate 11 having internal interconnects 18located in between can be coupled with each other using a mass reflowprocess, a thermal compression process, or a laser assist bondingprocess. In some examples, a gap can exist between electronic component14 and top substrate 19. In some examples, the top of electroniccomponent 14 can contact the bottom of top substrate 19.

In some examples, top substrate 19 can be provided over bottom substrate11, with the top substrate 19 being inverted with respect to bottomsubstrate 11. With substrates 19 and 11 coupled to each other, relativeorientations of their respective features or layers, such as conductivestructures 191 and 111, can be appreciated. In some examples, conductivestructure 191 is first built layer by layer on carrier 19A (FIGS. 2C-2D)and is then flipped before coupling over bottom substrate 11 (FIGS.2E-2F). Accordingly, the orientations of features of conductivestructures 191 and 111 can be considered inverted relative to eachother. For instance, a conductive path 1111 of conductive structure 111can comprise sibling trace 1111A and via 1111B, with via 1111B extendingfrom trace 1111A as part of a same metallic layer. Similarly, aconductive path 1911 of conductive structure 191 can comprise siblingtrace 1911A and via 1911B, with via 1911B extending from trace 1911A aspart of a same metallic layer. In the present example, vias 1111B ofconductive paths 1111 can be referred as downward vias, in that they arepositioned below or extend downward from their respective sibling traces1111A towards the bottom of semiconductor device 10. Conversely, vias1911B of conductive paths 1911 can be referred as upward vias, in thatthey are positioned above or extend upward from their respective siblingtraces 1911A towards the top of semiconductor device 10. In someexamples, conductive structure 111 comprises conductive path 1111comprising trace 1111A and downward via 1111B. In some examples, theconductive structure 191 comprises conductive path 1911 comprising trace1911A and upward via 1911B.

Multiple bottom substrate 11 units arrayed on bottom carrier 11A can besimultaneously coupled to respective multiple top substrate 19 unitsarrayed on top carrier 19A, while still attached to their respectivecarriers 11 or 19. Such processing permits economies of time and cost byavoiding the need to individually couple substrates 11 with substrates19 one at a time. In some examples, such simultaneous coupling can becarried out as a Panel-Level process, where carriers 11 or 19 cancomprise larger area rectangular panels that can accommodatesimultaneous coupling of further respective substrates 11 or 19 thanpossible with wafer-level or strip-level processes.

FIG. 2G shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2G, insulatingbody 15 can be located between top substrate 19 and bottom substrate 11.Body 15 can be over a top side of bottom substrate 11. In some examples,electronic component 14 can be in body 15 or can be at least partiallysurrounded by body 15. Body 15 can comprise or can be referred to as anencapsulant, a mold compound, a resin, or a sealant. In some examples,body 15 can comprise an organic material having inorganic fillerparticles such as silica. In some examples, body 15 can be injected orprovided using a transfer molding process. Accordingly, body 15 can filla space existing between top substrate 19 and bottom substrate 11. Insome examples, body 15 can be adhered to the bottom of top substrate 19and the top of bottom substrate 11 while covering lateral sides ofelectronic component 14 and internal interconnects 18. Underfill 16 canbe between electronic component 14 and the top side of bottom substrate11. If underfill 16 is provided separately, body 15 can cover exposedportions of underfill 16 as well. In some examples, body 15 can alsocover a gap existing between electronic component 14 and top substrate19. For example, body 15 can extend between a bottom side of the topsubstrate 19, and a top side of electronic component 14. When top sideof electronic component 14 and bottom side of top substrate 19 arebrought into close contact with each other, body 15 can be omittedbetween the top of electronic component 14 and the bottom of topsubstrate 19.

In some examples, top substrate 19 can comprise a dielectric structure192 over body 15, and conductive structure 191 through dielectricstructure 192. Conductive structure 191 can comprise conductive paths1911 which comprise one or more conductive redistribution layers.Internal interconnect 18 can be coupled between conductive structure 111and conductive structure 191.

FIG. 2H shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2H, bottomcarrier 11A can be removed from bottom substrate 11. In some examples,when temporary adhesive is located between bottom substrate 11 andbottom carrier 11A, adhesiveness of temporary adhesive can be removed byapplying heat or light, for example a laser beam, to the temporaryadhesive. In some examples, bottom carrier 11A can be removed frombottom substrate 11 using a mechanical force. In some examples, bottomcarrier 11A can be removed using mechanical polishing or chemicaletching process. In some examples, seed layer 11B can be removed frombottom interconnects 1113 and dielectric structure 112 located on bottomsubstrate 11. In some examples, seed layer 11B located on bottom sidesof bottom interconnects 1113 can be removed using a chemical etchingprocess. Accordingly, bottom sides of bottom interconnects 1113 can beexposed through dielectric structure 112.

FIG. 2I shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In some examples, prior to removing topcarrier 19A, bottom carrier 11A can be removed, and externalinterconnects 12 can be provided on the bottom side of bottom substrate11. In the example shown in FIG. 2I, external interconnects 12 can bepositioned or provided on the bottom of bottom substrate 11. In someexamples, external interconnects 12 can be coupled with the firstconductive structure 111, for example external interconnects 12 can beconnected to bottom interconnects 1113 located on bottom substrate 11.External interconnects 12 can comprise or can be referred to as pads,lands, bumps or solder balls. External interconnects 12 can be coupledwith bottom interconnects 1113 using a mass reflow process or a laserassist bonding process after positioning external interconnects 12 onbottom interconnects 1113. External interconnects 12 can have a diameterin the range from approximately 25 μm to approximately 300 μm. Externalinterconnects 12 can electrically connect semiconductor device 10 to anexternal device. In some examples, one or more electronic components 13can be coupled the bottom of bottom substrate 11. The one or moreelectronic components 13 can be coupled with conductive structure 111.

FIG. 2J show a cross-sectional views of semiconductor device 10 at alater stage of manufacture. In some examples, carrier 11D can beattached via temporary adhesive 110 adhered to bottom substrate 11 andexternal interconnects 12. Carrier 11D can be configured to maintainsemiconductor device 10 at a planar state during subsequent removal oftop carrier 19A.

FIG. 2K shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2K, top carrier19A can be removed from top substrate 19. Removing of top carrier 19Acan be similar to removing of bottom carrier 11A. In some examples, whena temporary adhesive is located between top substrate 19 and top carrier19A, adhesiveness of the temporary adhesive can be removed by applyingheat or light, for example a laser beam, to the temporary adhesive, toeasily remove top carrier 19A from top substrate 19. In some examples,seed layer 19B located on top interconnects 1912 of top substrate 19 canalso be removed using an etching process. Therefore, top interconnects1912 of top substrate 19 can be exposed through dielectric structure192. In some examples, another electronic device, another semiconductor,another device, or another semiconductor package can be coupled to topinterconnects 1912 of top substrate 19.

FIG. 2L shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2L, asingulation process can be performed. Semiconductor devices 10manufactured in arrays of mass quantities can be separated intoindividual semiconductor devices 10 at this stage. Top carrier 19A,bottom carrier 11A, and any additional carriers such as carrier 11D canbe removed, and semiconductor device 10 can be singulated through topsubstrate 19, bottom substrate 11, and body 15. In some examples, topsubstrate 19, body 15, and bottom substrate 11 can be subjected tosawing or singulation by means of a blade wheel or laser beam to provideeach individual semiconductor device 10. Due to such processingcharacteristics, lateral sides of top substrate 19, body 15, and bottomsubstrate 11 can be coplanar. In the example of FIG. 2L, sawing orsingulation lines are indicated by three thick vertical lines.

FIGS. 3A to 3G show cross-sectional views of an example method formanufacturing an example semiconductor device. In some examples, themethod for manufacturing semiconductor device 10 shown in FIGS. 3A to 3Gcan be similar to the method shown in FIGS. 2A to 2L. As shown in FIGS.3A-3G, substrates 19 can be coupled to bottom substrate 11 individuallyrather than simultaneously in array format. In some examples theopposite can occur, where bottom substrates 11 can be coupled to topsubstrate 19 individually.

FIG. 3A shows a cross-sectional view of semiconductor device 10 at anearly stage of manufacture. In the example shown in FIG. 3A, individualtop substrate 19 units can be provided by singulating through topsubstrate 19 and top carrier 19A to define a first top substrate 19unit. In some examples, each individual top substrate 19 unit can besingulated from top substrate 19 array. After singulation, lateral sidesof top substrate 19 and top carrier 19A can be coplanar. In FIG. 3A,sawing or singulation lines are indicated by four thick lines.

FIG. 3B shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3B, individualtop substrates 19 units can be provided over electronic component 14 andover bottom substrate 11 and can be coupled with bottom substrate 11. Insome examples, bottom interconnects 1913 of top substrate 19 can becoupled to top interconnects 1112 of bottom substrate 11 throughinternal interconnects 18. In some examples, individual top substrate 19units can be sequentially positioned on bottom substrate 11. In someexamples, individual top substrate 19 units can be simultaneouslypositioned on bottom substrate 11.

FIG. 3C shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3C, body 15 canbe provided between top substrate 19 unit and bottom substrate 11. Insome examples, since spaces or gaps are created between individual topsubstrates 19, body 15 can be provided using a compression moldingprocess in which resin is injected into the spaces or gaps. In someexamples, body 15 can be provided using a film assist molding process.In some examples, resin can be injected into spaces between topsubstrates 19 and bottom substrate 11 in a state in which an elasticfilm is positioned on multiple top substrates 19 and then compressedusing a mold. In some examples, film assist molding or transfer moldingcan be employed to provide body 15. Body 15 can be located on spaces orgaps between top carriers 19A, between substrates 19, and between topsubstrates 19 and bottom substrate 11. In some examples, body 15 cancover a periphery of the first top substrate 19 unit.

In some examples, top carrier 19A and body 15 can be subjected togrinding. As the result of grinding, top carrier 19A can have aremaining thickness of approximately 50 μm. In some examples, aftergrinding, top carrier 19A or body 15 can be chemically etched.

In some examples, a partial sawing process can be performed. In someexamples, the partial sawing process can be performed along peripheriesof top carrier 19A and top substrate 19. In some examples, the partialsawing process can also be performed on a region of body 15corresponding to the periphery of top substrate 19 unit. In someexamples, the partial sawing process can be performed by a blade wheelor laser beam. Peripheries of top carrier 19A and top substrate 19 canbe separated from body 15 by the partial sawing process. In someexamples, spaces or gaps can be provided between each of top carrier19A, top substrate 19, and body 15. In FIG. 3C, partial sawing lines areindicated in forms of straight lines.

FIG. 3D shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3D, top carrier19A or seed 19B can be removed from top substrate 19. In some examples,top carrier 19A can be removed prior to removal of bottom carrier 11A.Such a removing process can be similar to the process previouslydescribed in FIG. 2 for removing top carrier 19A from top substrate 19.Top interconnects 1912 of top substrate 19 can be exposed throughdielectric structure 192. In some examples, when top carrier 19A isremoved, a region of body 15 between top substrates 19 can protrude.Spaces or gaps can exist between the lateral sides of top substrate 19and body 15.

FIG. 3E shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3D, temporaryadhesive 19C can cover top substrates 19 and the protruding region ofbody 15, and another planar top carrier 19D can be adhered on temporaryadhesive 19C. Multiple top substrates 19 can be coupled to one singletop carrier 19D through temporary adhesive 19C. In some examples, theadditional top carrier 19D can be provided over the first top substrate19 unit prior to removing bottom carrier 11A.

FIG. 3F shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3F, bottomcarrier 11A can be removed from bottom substrate 11. In some examples,bottom carrier 11A can be removed prior to removing top carrier 19A.Seed layer 11B located at bottom of substrate 11 can be removed. Bottomsides of bottom interconnects 1113 can be exposed through dielectricstructure 112.

FIG. 3G shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3F, externalinterconnects 12 can be coupled to bottom interconnects 1113 of bottomsubstrate 11. In some examples, one or more electronic components 13 canalso be coupled to bottom of bottom substrate 11. In some examples,external interconnects 12 or electronic components 13 can be provided onthe bottom side of bottom substrate 11 after removing bottom carrier 11Aand can be coupled with first conductive structure 111.

FIG. 3H shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3H, top carrier19D can be removed from top substrate 19. In some examples, adhesivenessof the temporary adhesive 19C can be removed by applying heat or light,for example a laser beam, to the temporary adhesive 19C to easily removetop carrier 19D from top substrate 19. Accordingly, top interconnects1912 of top substrate 19 can be exposed through dielectric structure192. In addition, since the partial sawing process has been previouslyperformed, as described above, spaces or gaps can exist between sidesides of top substrates 19 and the protruding region of body 15.

FIG. 3I shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 3I, asingulation process can be performed. In some examples, additional topcarrier 19D can be removed prior to performing singulation. In someexamples, bottom substrate 11, body 15, and top substrate 19 can besubjected to singulation by a blade wheel or laser beam, yieldingindividual semiconductor device 10. In some examples, singulation linescan overlap with the previously described partial sawing lines. In someexamples, lateral sides of bottom substrate 11, body 15, and topsubstrate 19 can be coplanar. In FIG. 3I, sawing lines are indicated infour thick lines. In some examples, the first top substrate 19 unit,bottom substrate 11, and body 15 can be singulated.

FIG. 4 shows a cross-sectional view of an example semiconductor device20. In some examples, semiconductor device 20 can be similar tosemiconductor device 10 shown in FIG. 1 and can comprise adhesive 21. Insome examples, adhesive 21 can be between electronic component 14 andthe bottom side of top substrate 19. In some examples, adhesive 21 cancover a top side and a lateral side of electronic component 14. In someexamples, adhesive 21 can comprise a filler-free epoxy. In someexamples, adhesive 21 can be positioned between electronic component 14and top substrate 19. In some examples, top substrate 19 can be adheredto electronic component 14 through adhesive 21 before body 15 isprovided between top substrate 19 and bottom substrate 11. Such aconfiguration with adhesive 21 can facilitate embodiments where the gapbetween top substrate 19 and electronic component 14 would otherwise betoo narrow for body 15, or any filler material of body 15, to flowthrough or suitably fill when applied. In some examples, adhesive 21 canalso extend to contact lateral sides of electronic component 14 or cancontact a portion of underfill 16. In some examples, adhesive 21 can beprovided between a top side of electronic component 14 and the bottomside of top substrate 19 prior to providing body 14 between topsubstrate 19 and bottom substrate 11.

In some examples, adhesive 21 can be provided in a process of connectingtop substrate 19 and bottom substrate 11 to each other through internalinterconnects 18. In some examples, adhesive 21 can be applied first totop substrate 19 and then can be adhered to electronic component 14. Insome examples, adhesive 21 can be applied to electronic component 14 andthen can be adhered to top substrate 19. In some examples, body 15 canbe provided to contact the lateral or bottom periphery of adhesive 21.Adhesive 21 can have a thickness in the range from approximately 1 μm toapproximately 50 μm. Mechanical adhesion between electronic component 14and top substrate 19 can be enhanced by means of adhesive 21. In someexamples, the gap between electronic component 14 and top substrate 19can be minimized or narrowed when filled by adhesive 21 rather than bybody 15.

FIG. 5 shows a cross-sectional view of an example semiconductor device30. In the example shown in FIG. 5 , upper device portion 30B and lowerdevice portion 30A are shown coupled together to define semiconductordevice 30. Semiconductor device 30 can comprise cavity substrate 31,external interconnects 12, electronic component 14, underfill 16,internal interconnects 38, and substrate 39.

Cavity substrate 31 can comprise conductive structure 311 havingconductive paths 3111, top interconnects 3112, and bottom interconnects3113. Cavity substrate 31 can also comprise dielectric structure 312having one or more dielectric layers, body 315, or interface dielectric316. In some examples, cavity substrate 31 can comprise body 315 andinner sidewalls of body 315 defining a cavity and bounding electroniccomponent 14. In some examples, a gap is defined between one of theinner sidewalls of body 315 and a sidewall of electronic component 14.In some examples, internal interconnect 38 can comprise a pillar.

Substrate 39 can comprise conductive structure 391 having conductivepaths 3911, top interconnects 3912, and bottom interconnects 3913.Substrate 39 can also comprise dielectric structure 392 having one ormore dielectric layers and interface dielectric 396.

In some examples, cavity substrate 31 or cavity substrate 39 can besimilar to other substrates described in this disclosure, such assubstrate 11 or 19. In some examples, cavity substrate 31, conductivestructure 311, conductive paths 3111, top interconnects 3112, bottominterconnects 3113, or dielectric structure 312, can be respectivelysimilar to substrate 11, conductive structure 111, conductive paths1111, top interconnects 1112, bottom interconnects 1113, or dielectricstructure 112 described in this disclosure. In some examples, substrate39, conductive structure 391, conductive paths 3911, top interconnects3912, bottom interconnects 3913, or dielectric structure 392 can berespectively similar to substrate 19, conductive structure 191,conductive paths 1911, top interconnects 1912, bottom interconnects1913, or dielectric structure 192 described in this disclosure. In someexamples, cavity substrate 31 or substrate 39 can comprise an RDLsubstrate.

Cavity substrate 31, external interconnects 12, underfill 16, internalinterconnects 38, and substrate 39 can be referred to as semiconductorpackage.

FIGS. 6A to 6Q show cross-sectional views of an example method formanufacturing an example semiconductor device 30. FIGS. 6A-6J show viewsof a method for manufacturing lower device portion 30A of semiconductordevice 30. FIGS. 6K-6O show views of a method for manufacturing upperdevice portion 30B of semiconductor device 30. FIGS. 6P-6Q show views ofa method to couple lower device portion 30A and upper device portion 30Bto define semiconductor device 30.

FIG. 6A shows a cross-sectional view of semiconductor device 30 at anearly stage of manufacture. In the example shown in FIG. 6A, planar body315A can be provided. In some examples, body 315A can comprise a siliconmaterial, a glass material, a ceramic material, or an inorganicmaterial. In some examples, body 315A can be in the form of a wafer, astrip, or a panel.

FIG. 6B shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6B, openingscan be formed in body 315A, and conductive structures, for exampleinternal interconnects 38, can be positioned inside the openings. Insome examples, high aspect ratio openings can be located in body 315Ausing a plasma etching process, a laser beam process or a chemicaletching process. In some examples, openings can have an aspect ratio,such as a width to height ratio, in the range from approximately 1:10 toapproximately 1:15. In some examples, openings can have a depth in therange from approximately 1 μm to approximately 20 μm. In some examples,the openings can have a width or a pitch or approximately 1 μm toapproximately 20 μm. In some examples, openings can have a depth smallerthan a thickness of body 315A.

In some examples, an insulation layer can be located on interior sidesof openings, a seed layer can then be located on interior side of theinsulation layer, and internal interconnects 38 can be formed orpositioned on the interior side of the seed layer. In some examples,when body 315A is made of silicon, the insulation layer positionedinside openings can comprise a silicon oxide layer or a silicon nitridelayer. In some examples, when body 315A is made of glass or ceramic, theinsulation layer can comprise polyimide (PI), benzocyclobutene (BCB), orpolybenzoxazole (PBO). In some examples, the insulation layer can have athickness of approximately 0.1 μm to approximately 1 μm. In someexamples, the seed layer can be provided using an electroless platingprocess, an electroplating process, or a sputtering process. In someexamples, titanium tungsten (TiW) can first be deposited, and thencopper (Cu) can then be electrolessly deposited on the TiW. The seedlayer can have a thickness in the range from approximately 0.1 μm toapproximately 1 μm. The seed layer can allow current to be distributedfor the formation of internal interconnects 38 by electroplating.Internal interconnects 38 can be provided by plating copper (Cu), byplating nickel (Ni), by sequentially plating gold (Au) and copper (Cu),or by sequentially plating gold (Au) and nickel (Ni) on the seed layer.In some examples, internal interconnects 38 can be provided usingelectroplating equipment containing a copper (Cu) solution, a nickel(Ni) solution, or a gold (Au) solution. In some examples, after internalinterconnects 38 are positioned in body 315A, top sides of body 315A andinternal interconnects 38 can be planarized or subjected to grinding toallow top sides of body 315A and internal interconnects 38 to becoplanar. In some examples, internal interconnects 38 can comprise orcan be referred to as pillars, vias, Through Silicon Vias (TSVs), orThrough Glass Vias (TGVs). Internal interconnects 38 can have aline/space/thickness of approximately 0.5/0.5/0.5 μm to approximately10/10/10 μm. In some examples, interconnects 1113 can have aline/space/thickness in the range from approximately 0.5/0.5/0.5 μm toapproximately 10/10/10 μm.

FIG. 6C shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6C, conductivestructure 311 and dielectric structure 312 can be provided on body 315A.A layer of dielectric structure 312 can be deposited on body 315A andinternal interconnects 38. In some examples, the layer of dielectricstructure 312 can be provided using a spin coating process or a spraycoating process. In some examples, dielectric structure 312 can compriseor can be referred to as PI, BCB, or PBO. In some examples, the layer ofdielectric structure 312 can have a thickness in the range fromapproximately 2 μm to approximately 20 μm.

In some examples, a patterned mask can be positioned on the layer ofdielectric structure 312 and light can be irradiated on the mask. Insome examples, such a photolithography process can be performed usingstepper equipment. Patterned portions or non-patterned portions of themask can be developed. Openings or patterns can be formed in the layerof dielectric structure 312, corresponding to the patterned mask, toexpose internal interconnects 38 or portions of body 315A. The seedlayer can be located on internal interconnects 38 positioned insideopenings of dielectric structure 312, or on body 315A positioned insideopenings of dielectric structure 312. Interconnects 3112 of conductivestructure 311 can be formed on the seed layer over internalinterconnects 38 or over exposed portions of body 315A. In someexamples, interconnects 3112 can comprise or can be referred to as pads,lands, Under Bumped Metallizations (UBMs), or pillars. In some examplesinterconnects 3112 can be provided by plating copper (Cu) over internalinterconnects 38, or over portions of body 315A, through openings ofdielectric structure 312. In some examples, interconnects 3112 can havea line/space/thickness of approximately 0.5/0.5/0.5 μm to approximately10/10/10 μm. In some examples, interconnects 3112 can be provided usingelectroplating equipment containing a copper (Cu) solution.

One or more other seed layers, dielectric layers of dielectric structure312, or conductive layers of conductive structure 311, can be furtherprovided in a similar manner to that described above to definedielectric structure 312, conductive paths 3111, and interconnects 3113.Conductive paths 3111 can comprise or can be referred to as traces,vias, or patterns. In addition, conductive paths 3111 can be generallypositioned between dielectric layers of dielectric structure 312.Interconnects 3113 can comprise or can be referred to as pads, lands,Under Bumped Metallizations (UBMs), or pillars. Interconnects 3113 canbe exposed through dielectric structure 312. In some examples, top sidesof interconnects 3113 can be coplanar with a top side of dielectricstructure 312. In some examples, bottom sides of interconnects 3112 canbe coplanar with a bottom side of dielectric structure 312.

In some examples, conductive paths 3111 can electrically connectinterconnects 3112 with interconnects 3113, and interconnects 3112 canelectrically connect conductive paths 3111 with internal interconnects38. In some examples, more or fewer layers of conductive structure 311or of dielectric structure 312 can be provided. In some examples,multiple cavity substrate units can be formed on one single body 315A informs of strips or arrays to enhance production efficiency for multiplesemiconductor device 30.

FIG. 6D shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6D, carrier 31Acan be attached to conductive structure 311 and dielectric structure312. In some examples, carrier 31A can be attached using temporaryadhesive 31B. In some examples, temporary adhesive 31B can lose itsadhesiveness by heat or a laser beam. In some examples, temporaryadhesive 31B can also be referred to as a release layer. Carrier 31A cancomprise or can be referred to as silicon, glass, ceramic, or metal.Carrier 31A can support body 315A, conductive structure 311, anddielectric structure 312 and can prevent warpage during stages ofmanufacture.

FIG. 6E shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6E, a bottomside of body 315A can be thinned or planarized, such as by grinding. Insome examples, as the bottom side of body 315A is thinned, ends ofinternal interconnects 38 can be exposed.

FIG. 6F shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture, having been flipped from the view shown inFIG. 6E. In the example shown in FIG. 6F, body 315 comprises innersidewalls that define cavity 315B. In some examples, a section of body315 covering interconnects 3112 can be removed to define cavity 315Bwithin body 315. In some examples, dry etching or wet etching can beemployed in removing the such section of body 315. In some examples,plasma-state etching gas can be supplied to provide cavity 315B in body315, for example a drying etching process). In some examples, nitricacid (HNO3), acetic acid (CH3COOH), or hydrofluoric acid (HF) solutionscan be supplied to provide cavity 315B in body 315, for example via awet etching process. Etching can be performed until dielectric structure312 and conductive structure 311, for example interconnects 3112, areexposed from body 315. In some examples, cavity 315B can have a widthequal to or greater than a width of electronic component 14.

FIG. 6G shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6G, electroniccomponent 14 can be mounted inside cavity substrate 31. Electroniccomponent 14 can be coupled with interconnects 3112 arranged insidecavity 315B through device interconnects 141.

In some examples, underfill 16 can be positioned between electroniccomponent 14 and cavity substrate 31. In some examples, underfill 16 canfill the space between the bottom side of electronic component 14 andthe top side of cavity 315B. In some examples, underfill 16 can fill thespace between the lateral sides of electronic component 14 and the innersidewalls of cavity 315B. In some examples, underfill 16 can be injectedinto cavity 315B after electronic component 14 is coupled with cavitysubstrate 31. In some examples, underfill 16 can be applied in cavity315B in advance before electronic component 14 is connected to cavitysubstrate 31. In some examples, a top side of underfill 16 can becoplanar with top sides of electronic component 14 and body 315. In someexamples, the top of electronic component 14 or the top of underfill 16can protrude past the top of body 315. In examples where such protrusioninitially happens, the tops of electronic component 14, of underfill 16,and of body 315 can be planarized to be coplanar, for example by agrinding process.

FIG. 6H shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6H, a wet ordry etching process can be performed to allow ends of internalinterconnects 38 to protrude from body 315. Electronic component 14 andor underfill 16 can also protrude from the top side of body 315 due tosuch etching process.

FIG. 6I shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6I, interfacedielectric 316 can be applied. In some examples, interface dielectric316 can cover body 315, internal interconnects 38, electronic component14, or portions of underfill 16. In some examples, interface dielectric316 can be referred to as an insulation layer or a passivation layer. Insome examples, interface dielectric 316 can comprise or can be referredto as a rigid inorganic material, for example silicon oxide or siliconnitride. In some examples, interface dielectric 316 can be provided bychemical vapor deposition (CVD), physical vapor deposition (PVD), atomiclayer deposition (ALD), low pressure chemical vapor deposition (LPCVD),or plasma enhanced chemical vapor deposition (PECVD). In some examples,interface dielectric 316 can comprise or can be referred to as a softorganic material, such as for example, polyimide (PI), benzocyclobutane(BCB) or polybenzoxazole (PBO). In some examples, interface dielectric316 can be provided using a spin coating process, a spray coatingprocess, a dip coating process, or a rod coating process.

FIG. 6J shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 6J, aplanarization process can be performed. In some examples, an upperregion of cavity substrate 31 can be planarized. In some examples, theplanarization process can comprise or can be referred to as a chemicalmechanical polishing (CMP) process or a fly-cutting process. In someexamples, when interface dielectric 316 is made of an inorganicmaterial, the CMP process can be used, and when interface dielectric 316is made of an organic material, the flying-cut process can be used. Inthe CMP process, the inorganic material can be planarized by a rotatingpolishing pad and slurry, and in the fly-cutting process, the organicmaterial is cut into bits to planarize its side.

In some examples, the planarization process can be performed by removinginterface dielectric 316 until upper regions of internal interconnects38, electronic component 14, or underfill 16 are exposed. Top sides ofinternal interconnects 38, electronic component 14, underfill 16, andinterface dielectric 316 can be made coplanar. In some examples,interface dielectric 316 remaining after planarization can have athickness of approximately 0.1 μm to approximately 10 μm. The structureshown in FIG. 6J can be referred to as lower device portion 30A ofsemiconductor device 30.

FIGS. 6K to 6O show a cross-sectional view of semiconductor device 30 atanother stage of manufacture. In the example shown in FIGS. 6K-6O, amethod to manufacture upper device portion 30B of semiconductor device30 is presented. The processes shown in FIGS. 6K to 6O can be similar tothose shown in FIGS. 6A to 6J for lower device portion 30A, except thatno cavity exists in body 395 and electronic component 14 is not mounted.In some examples, the processes shown in FIGS. 6K to 6O can be firstperformed and the processes shown in FIGS. 6A to 6J can then beperformed. In some examples, the processes shown in FIGS. 6K to 6O andthe processes shown in FIGS. 6A to 6J can be simultaneously performed.

In some examples, the stage and elements shown in FIG. 6K for theformation of upper device portion 30B can be similar to correspondingstages or elements described above in FIGS. 6A-6D for the formation oflower device portion 30A. The stage shown in FIG. 6K, with body 395supporting dielectric structure 392 and its one or more dielectriclayers and conductive structure 391 and its conductive paths 3911,interconnects 3912, and interconnects 3913, can be reached, for exampleby a process similar to that described in FIGS. 6A-6D for respectivelyproviding body 315A supporting dielectric structure 312 (and its one ormore dielectric layers and conductive structure 311 and its conductivepaths 3111, interconnects 3112, and interconnects 3113.

In some examples, the stage and elements shown in FIG. 6L for theformation of upper device portion 30B can be similar to correspondingstage or elements described above in FIG. 6E for the formation of lowerdevice portion 30A. In some examples, the stage and elements shown inFIG. 6M for the formation of upper device portion 30B can be similar tocorresponding stage or elements described above in FIG. 6H for theformation of lower device portion 30A.

In some examples, the stage and elements shown in FIG. 6N for theformation of upper device portion 30B can be similar to correspondingstage or elements described above in FIG. 6I for the formation of lowerdevice portion 30A. In some examples, the stage and elements shown inFIG. 6O for the formation of upper device portion 30B can be similar tocorresponding stage or elements described above in FIG. 6J for theformation of lower device portion 30A.

In the example shown in FIGS. 6K to 6O, carrier 39A can be coupled withsubstrate 39 through temporary adhesive 39B. Substrate 39 can comprisebody 395, conductive structure 391, and dielectric structure 392.Interconnects 3913 of conductive structure 391 can extend or protrudeinto body 395. Conductive paths 3911 or interconnects 3912 of conductivestructure 391 can be positioned inside dielectric structure 392. In someexamples, more or fewer layers of conductive structure 391 or ofdielectric structure 392 can be provided. Interface dielectric 396 canbe located on bottom side of body 395. In some examples, interfacedielectric 396 can be similar to interface dielectric 316 previouslydescribed in terms of material, structure, or method of formation. Insome examples, bottom ends of interconnects 3913 can be coplanar with orexposed from the bottom side of interface dielectric 396.

FIGS. 6P to 6Q show a cross-sectional view of semiconductor device 30 ata later stage of manufacture. In the example shown in FIGS. 6P to 6Q,upper device portion 30B with substrate 39, and lower device portion 30Awith cavity substrate 31, can be coupled to each other. In someexamples, internal interconnects 38 of cavity substrate 31 andinterconnects 3913 of substrate 39 can be coupled with each other. Insome examples, interface dielectric 316 of cavity substrate 31 can bemechanically connected to interface dielectric 396 of substrate 39. Insome examples, top side of electronic component 14 can be broughtadjacent or into contact with interface dielectric 396 of substrate 39.

Prior to the connection process, plasma treatment can be performed. Insome examples, exposed ends of internal interconnects 38 of cavitysubstrate 31 and interface dielectric 316 can be treated with plasma. Insome examples, exposed ends of bottom interconnects 3913 of substrate 39and interface dielectric 396 can be treated with plasma.

Thereafter, a soaking process can be performed. In some examples, cavitysubstrate 31 and substrate 39 can be soaked at a temperature in therange from approximately 50 degrees Celsius (° C.) to approximately 100°C. for approximately 1 minute to approximately 60 minutes.

Next, cavity substrate 31 and substrate 39 can be aligned to each other,and then internal interconnects 38 of cavity substrate 31 andinterconnects 3913 of substrate 39 can be brought into contact with eachother. In some examples, the soaking process can be performed during thecontacting process. In some examples, thermal compression bondingprocess can then be performed. In some examples, an annealing processcan be performed to firmly bond interconnects 3913 of substrate 39 withinternal interconnects 38 of cavity substrate 31. In some examples,substrate 39 can be compressed onto cavity substrate 31 at a temperatureof 100° C. to 250° C. to perform a temporary bonding process. In someexamples, the annealing process can be performed at a temperature of100° C. to 250° C., to secure the electrically connection or bottominterconnects 3913 of substrate 39 to internal interconnects 38 ofcavity substrate 31. In some examples, interface dielectric 396 ofsubstrate 39 can be in contact with interface dielectric 316 of cavitysubstrate 31.

In some examples, the connection between interconnects 3913 of substrate39 and internal interconnects 38 of cavity substrate can be achievedwithout the use of solder. In some examples, a solderless interfaceregion can be visually observed between internal interconnects 38 ofcavity substrate 31 and bottom interconnects 3913 of substrate 39. Insome examples, if internal interconnects 38 and bottom interconnects3913 are thermally diffused sufficiently by the thermal compressionprocess and the annealing, the interface region at their junction may beharder to be visually observed but can be detected spectroscopically.

Carrier 31A attached to cavity substrate 31 and carrier 39A attached tosubstrate 39 can be removed in a manner similar to that described above.In some examples, temporary adhesives 31B and 39B can also be removed.Bottom interconnects 3113 of cavity substrate 31 can be exposed, and topinterconnects 3912 substrate 39 can also be exposed. Externalinterconnects 12 can be connected to bottom interconnects 3113 of cavitysubstrate 31 in a manner similar to that described above, therebycompleting semiconductor device 30.

In the processes shown in FIGS. 6A to 6Q, multiple units can be providedin forms of arrays in strips, wafers, or panels, which are finallyseparated into individual semiconductor devices 30 by sawing orsingulation. In some examples, multiple lower device portions 30A can beprovided in the form of an array and can be coupled with multiple upperdevice portions 30A in the form of arrays or strips. In some examples,multiple lower device portions 30A can be provided in the form of anarray and can be coupled with individual upper device portions 30A. Insome examples, multiple individual device portions 30A can be providedand can be coupled with multiple upper device portions 30A in form ofarray.

FIG. 7 shows cross-sectional views of an example method formanufacturing an example semiconductor device 40. In the example shownin FIG. 7 , semiconductor device 40 can be similar to semiconductordevice 30 shown in FIG. 5 , and interconnecting material 41 is furtherprovided. In some examples, interconnecting material 41 can bepositioned between internal interconnects 38 of cavity substrate 31 andbottom interconnects 3913 of substrate 39. In some examples,interconnecting material 41 can comprise or can be referred to assolder, gold (Au) or silver (Ag). In some examples, interconnectingmaterial 41 can have a thickness in the range from approximately 1nanometer (nm) to approximately 2000 nm.

Interconnecting material 41 can increase interconnecting reliabilitybetween internal interconnects 38 of cavity substrate 31 and bottominterconnects 3913 of substrate 39 while lowering an interconnectionprocess temperature. In some examples, lateral sides of interconnectingmaterial 41 can be covered by interface dielectric 316 of cavitysubstrate 31 or interface dielectric 396 of substrate 39.

FIG. 8 shows cross-sectional view of an example method for manufacturingexample semiconductor device 40. In the example shown in FIG. 8 ,interconnecting material 41 can be first applied to bottom interconnects3913 of substrate 39 and then be connected to internal interconnects 38of cavity substrate 31. Thereafter, a thermal compression bondingprocess, a mass reflow process, or a laser beam assist bonding processcan be performed. Interconnecting material 41 shown in FIG. 8 can bondbottom interconnects 3913 with internal interconnects 38 at atemperature lower than the solderless metal-to-metal bonding temperaturerequired for the example of semiconductor device 30 described withrespect to FIGS. 5-6 .

FIGS. 9A to 9D represent several options, based on the examples of FIGS.5-8 , for bonding between internal interconnects 38 of cavity substrate31 and bottom interconnects 3913 of substrate 39. The followingdescription will be made with representative examples of interfacedielectrics 316 and 396 comprising several inorganic dielectrics ororganic dielectrics, but other inorganic or organic dielectrics can beused. Internal interconnects 38 will be representatively described ascomprising one or more metallic layers, but other conductors can beused. In addition, for better understanding, in the followingdiscussion, cavity substrate 31 will be described with regard to onlyinternal interconnects 38 and interface dielectric 316, and substrate 39will be described with regard to only bottom interconnects 3913 andinterface dielectric 396.

In the example shown in FIG. 9A, an example structure can employ siliconoxide as interface dielectric 316 of cavity substrate 31 and can employcopper as internal interconnects 38 of cavity substrate 31. An examplestructure can employ silicon oxide as interface dielectric 396 ofsubstrate 39 and can employ copper as bottom interconnects 3913 ofsubstrate 39. Copper employed for cavity substrate 31 and copperemployed for substrate 39 can be directly bonded to each other using asolderless metal-to-metal bonding process, such as by annealing, andsilicon oxide employed for cavity substrate 31 and silicon oxideemployed for substrate 39 can be bonded to each other using, forexample, a covalent bonding process by annealing. Because hard inorganicmaterial such as silicon oxide is used as interface dielectrics 316 and396, a CMP process can be used to achieve planarization. Such an examplestructure can have a high unit per hour (UPH) rate and can provide astable bonding structure even at a cryogenic temperature.

In the example shown in FIG. 9B, the example structure can be similar tothat shown in FIG. 9A, except that solder or tin (Sn) is positioned asinterconnecting material 41 between internal interconnects 38 of cavitysubstrate 31 and bottom interconnects 3913 of substrate 39. Here, afterplanarization, for example using a CMP process, tin (Sn) can beimmersion-plated on internal interconnects 38 of cavity substrate 31 orbottom interconnects 3913 of substrate 39, and can be positioned asinterconnecting material 41 between internal interconnects 38 of cavitysubstrate 31 and bottom interconnects 3913 of substrate 39. Such thindeposition or plating of solder or tin (Sn) can assist in the bonding atlower temperature of internal interconnects 38 of cavity substrate 31with bottom interconnects 3913 of substrate 39.

In the example shown in FIG. 9C, the example structure can be similar tothat shown in FIG. 9A, except that organic dielectric such asbenzocyclobutane (BCB) can be used as interface dielectric 396 ofsubstrate 39. In such a manner, copper employed for cavity substrate 31and copper employed for substrate 39 can be bonded to each other by athermal compression bonding and annealing, and silicon oxide employedfor cavity substrate 31 and BCB employed for substrate 39 can be bondedto each other by thermal compression bonding and annealing. Because asoft organic material such as BCB is used as interface dielectric 396 ofsubstrate 39, a fly-cutting process can be used to achieveplanarization. Because a hard inorganic material such as silicon oxideis used as interface dielectric 396, a CMP process can be used toachieve planarization. Such bonding processes using both of theinorganic material and the organic material can make example structureless sensitive to particles and can provide a high bonding force betweencavity substrate 31 and substrate 39.

In the example shown in FIG. 9D, the example structure can be similar tothat shown in FIG. 9C, except that organic dielectric such asbenzocyclobutane (BCB) can be used as interface dielectric 316 of cavitysubstrate 31. In such a manner, copper employed for cavity substrate 31and copper employed for substrate 39 can be interconnected by thermalcompression bonding and annealing, and BCB employed for cavity substrate31 and BCB employed for substrate 39 can be interconnected by thermalcompression bonding and annealing. Because a soft organic material suchas BCB is used as interface dielectrics 316 and 396 of cavity substrate31, a fly-cutting process can be used to achieve side planarization.

FIGS. 10A to 10D represent several options, based on the examples ofFIGS. 5-8 , for bonding between internal interconnects 38 of cavitysubstrate 31 and bottom interconnects 3913 of substrate 39. Thefollowing description will be made with representative examples ofinterface dielectrics 316 and 396 comprising several inorganicdielectrics or organic dielectrics, but other inorganic or organicdielectrics can be used. Internal interconnects 38 will berepresentatively described as comprising one or more metallic layers,but other conductors can be used. In addition, for better understanding,in the following discussion cavity substrate 31 will be described withregard to only internal interconnects 38 and interface dielectric 316,and substrate 39 will be described with regard to only bottominterconnects 3913 and interface dielectric 396.

In the example shown in FIG. 10A, example structure can employ siliconoxide as interface dielectric 316 of cavity substrate 31 and can employcopper as internal interconnects 38 of cavity substrate 31. The examplestructure can further employ gold (Au) plated on internal interconnects38 to increase wettability. In some examples, gold (Au) plating can havea thickness in the range from approximately 1 nm to approximately 10 nm.Example structure can employ BCB as interface dielectric 396 ofsubstrate 39 or can employ nickel as bottom interconnects 3913 ofsubstrate 39. Solder or tin (Sn) can be plated as interconnectingmaterial 41. In some examples, solder or tin (Sn) plating can have athickness in the range from approximately 2 μm to approximately 6 μm.Interconnect material 41 can be generally embedded in interfacedielectric 396. In some examples, because a hard inorganic material suchas silicon oxide is used as interface dielectric 316 of cavity substrate31, a CMP process can be used to achieve planarization. Because a softorganic material such as BCB is used as interface dielectric 396 ofsubstrate 39, a fly-cutting process can be used to achieveplanarization. Internal interconnects 38 (Cu an Au) of cavity substrate31 can be connected with bottom interconnects 3913 (Ni) of substrate 39using interconnect material 41 such as solder or Sn.

In the example shown in FIG. 10B, the example structure can employ BCBas interface dielectric 316 of cavity substrate 31 and can employ nickelas bottom interconnects 3913 of cavity substrate 31 or as internalinterconnects 38 of cavity substrate 31. Solder or tin (Sn) can bepositioned as interconnecting material 41. Interconnect material 41 canbe embedded in interface dielectric 316 of cavity substrate 31 or ininterface dielectric 396 of substrate 39. In some examples, because asoft organic material such as BCB is used as interface dielectrics 316and 396 for both of cavity substrate 31 and substrate 39, cavitysubstrate 31 and substrate 39 can be both planarized using a fly-cuttingprocess. Internal interconnects 38 (Ni) of cavity substrate 31 can beconnected to bottom interconnects 3913 (Ni) of substrate 39 usinginterconnect material 41, such as solder or Sn.

In the example shown in FIG. 100 , the example structure can be similarto that shown in FIG. 10A, except that polyimide (PI) can be used asinterface dielectric 396 of substrate 39. Such an arrangement can makeexample structure less sensitive to particles or can provide a highbonding force between cavity substrate 31 and substrate 39.

In the example shown in FIG. 10D, the example structure can be similarto that shown in FIG. 10B, except that polyimide (PI) can be used asboth interface dielectric 316 of cavity substrate 31 and interfacedielectric 396 of substrate 39. In such a manner, nickel of cavitysubstrate 31 and nickel of substrate 39 can be interconnected by thermalcompression bonding, and PI of cavity substrate 31 and PI of substrate39 can also be interconnected by thermal compression bonding.

The present disclosure includes reference to certain examples. It willbe understood by those skilled in the art, however, that various changesmay be made, and equivalents may be substituted without departing fromthe scope of the disclosure. In addition, modifications may be made tothe disclosed examples without departing from the scope of the presentdisclosure. Therefore, it is intended that the present disclosure is notlimited to the examples disclosed, but that the disclosure will includeall examples falling within the scope of the appended claims.

The invention claimed is:
 1. A semiconductor device, comprising: a firstredistribution layer (RDL) substrate comprising: a first dielectricstructure; and a first conductive structure through the first dielectricstructure and comprising one or more first conductive redistributionlayers; an electronic component over the first RDL substrate, whereinthe electronic component is coupled with the first conductive structure;a body over a top side of the first RDL substrate, wherein theelectronic component is in the body; a second RDL substrate comprising:a second dielectric structure over the body; and a second conductivestructure through the second dielectric structure and comprising one ormore second conductive redistribution layers; and an internalinterconnect coupled between the first conductive structure and thesecond conductive structure; wherein: the first conductive structurecomprises a conductive path comprising a trace and a downward viaextending downward from the trace, wherein the downward via and thetrace comprise a same metallic layer; the second conductive structurecomprises a conductive path comprising a trace and an upward viaextending upward from the trace, wherein the upward via and the tracecomprise a same metallic layer; and the body directly contacts the firstRDL substrate and directly contacts the second RDL substrate.
 2. Thesemiconductor device of claim 1, further comprising an underfill betweenthe electronic component and the top side of the first RDL substrate,and contacting a bottom side of the electronic component.
 3. Thesemiconductor device of claim 1, wherein the body extends between abottom side of the second RDL substrate and a top side of the electroniccomponent.
 4. The semiconductor device of claim 1, further comprising anadhesive between the electronic component and a bottom side of thesecond RDL substrate, wherein the adhesive covers a top side and alateral side of the electronic component.
 5. The semiconductor device ofclaim 1, wherein the first dielectric structure and the seconddielectric structure are coreless.
 6. The semiconductor device of claim1, wherein the first RDL substrate is a cavity substrate comprising thebody and inner sidewalls of the body defining a cavity and bounding theelectronic component.
 7. The semiconductor device of claim 6, wherein agap is defined between one of the inner sidewalls of the body and asidewall of the electronic component.
 8. The semiconductor device ofclaim 1, wherein the internal interconnect comprises a metallic-coreball having a solder coating.
 9. The semiconductor device of claim 1,wherein the internal interconnect comprises a pillar.
 10. Thesemiconductor device of claim 1, further comprising an additionalelectronic component on a bottom side of the first RDL substrate,wherein the additional electronic component is coupled with the firstconductive structure and comprises a resistor, a capacitor, an inductor,or a transistor.
 11. A method to manufacture a semiconductor device,comprising: providing a bottom substrate on a bottom carrier, whereinthe bottom substrate comprises a first dielectric structure, a firstconductive structure, and a top interconnect at a first side of thebottom substrate; providing an electronic component over the bottomsubstrate, wherein the electronic component is coupled with the firstconductive structure; providing a top substrate on a top carrier,wherein the top substrate comprises a second dielectric structure, asecond conductive structure, and a bottom interconnect on a first sideof the top substrate; providing an internal interconnect coupled withone of the top interconnect of the bottom substrate or the bottominterconnect of the top substrate; providing the top substrate over thebottom substrate, wherein the top substrate is inverted with respect tothe bottom substrate; coupling the internal interconnect to another oneof the top interconnect of the bottom substrate or the bottominterconnect of the top substrate; providing a body between the bottomsubstrate and the top substrate, wherein the electronic component is inthe body; removing the top carrier and the bottom carrier; andsingulating through the top substrate, the bottom substrate, and thebody; wherein the body is provided after said coupling and prior toremoving the top carrier and the bottom carrier, and the body contactsthe top substrate and the bottom substrate.
 12. The method of claim 11,comprising, prior to removing the top carrier: removing the bottomcarrier; and providing an external interconnect on a bottom side of thebottom substrate and coupled with the first conductive structure. 13.The method of claim 11, comprising providing an adhesive between a topside of the electronic component and the first side of the top substrateprior to providing the body.
 14. A method to manufacture a semiconductordevice, comprising: providing a bottom substrate on a bottom carrier,wherein the bottom substrate comprises a first dielectric structure, afirst conductive structure, and a top interconnect at a first side ofthe bottom substrate; providing an electronic component over the bottomsubstrate, wherein the electronic component is coupled with the firstconductive structure; providing a top substrate on a top carrier,wherein the top substrate comprises a second dielectric structure, asecond conductive structure, and a bottom interconnect on a first sideof the top substrate; providing an internal interconnect coupled withone of the top interconnect of the bottom substrate or the bottominterconnect of the top substrate; singulating through the top substrateand the top carrier to define a first top substrate unit; providing thefirst top substrate unit over the electronic component and over thebottom substrate; coupling the internal interconnect with another one ofthe top interconnect of the bottom substrate or the bottom interconnectof the top substrate; providing a body between the bottom substrate andthe first top substrate unit, wherein the electronic component is in thebody, and wherein the body covers a periphery of the first top substrateunit; removing the top carrier and the bottom carrier; and singulatingthe first top substrate unit, the bottom substrate, and the body;wherein the body is provided after said coupling and prior to removingthe top carrier and the bottom carrier, and the body contacts the topsubstrate and the bottom substrate.
 15. The method of claim 14,comprising: prior to removing the bottom carrier, removing the topcarrier from the first top substrate unit; and providing an additionalcarrier over the first top substrate unit; after removing the bottomcarrier; providing an external interconnect on a bottom side of thebottom substrate; and removing the additional carrier prior toperforming singulating of the first top substrate unit, the bottomsubstrate, and the body.
 16. The method of claim 14, comprisingproviding an additional electronic component on a bottom side of thebottom substrate, wherein the additional electronic component is coupledwith the first conductive structure.
 17. The method of claim 14,wherein: singulating the first top substrate unit, the bottom substrate,and the body comprises: partially sawing along the periphery of thefirst top substrate unit, and then singulating through the body and thebottom substrate.
 18. A semiconductor device, comprising: a firstredistribution layer (RDL) substrate comprising: a first dielectricstructure; and a first conductive structure through the first dielectricstructure and comprising one or more first conductive redistributionlayers; an electronic component over the first RDL substrate, whereinthe electronic component is coupled with the first conductive structure;a body over a top side of the first RDL substrate, wherein theelectronic component is in the body; a second RDL substrate comprising:a second dielectric structure over the body; and a second conductivestructure through the second dielectric structure and comprising one ormore second conductive redistribution layers; and an internalinterconnect coupled between the first conductive structure and thesecond conductive structure; wherein: the first conductive structurecomprises a conductive path comprising a trace and a downward viaextending downward from the trace; the second conductive structurecomprises a conductive path comprising a trace and an upward viaextending upward from the trace; the body directly contacts the firstRDL substrate and directly contacts the second RDL substrate; and thefirst RDL substrate is a cavity substrate comprising the body and innersidewalls of the body defining a cavity and bounding the electroniccomponent.
 19. The semiconductor device of claim 18, wherein a gap isdefined between one of the inner sidewalls of the body and a sidewall ofthe electronic component.
 20. The semiconductor device of claim 19,further comprising an underfill in the gap.